Simulation of Solidification Process of BGA Tin-Lead Solder ball Based on Cellular Automaton Method
نویسندگان
چکیده
منابع مشابه
Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards
Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction in surface insulation resistance (SIR) between adjacent conductors, generate a path of leakage current, and lead to intermittent or catastrophic circuit failures. Solder mask has been widely used on printe...
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ژورنال
عنوان ژورنال: Journal of Physics: Conference Series
سال: 2020
ISSN: 1742-6588,1742-6596
DOI: 10.1088/1742-6596/1622/1/012054